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          RF & Microwave PCBs

          TTM applications based approach provides innovative engineering and advanced process capabilities.

          From defense/aerospace electronics, medical devices and imaging, or complex telecommunications equipment, TTM supports a wide range of frequency bands (L, S, C, X, Ku, K, Ka, V, W). We have extensive experience with a wide range of low loss laminates and a total of over 70 resin systems.

          Our Field Applications Engineering team provides a long history of collaborative engineering support. Qualifications include MIL-PRF-31032, AS 9100, ITAR, IPC 6012 & IPC6018, NADCAP.

          Our Capabilities Include:

          Tight Etch Tolerances on Critical RF Features

          • +/- .0005" standard tolerance on etched features for unplated 0.5oz copper
          • Selective plated up layers allowing +/- .0005" etch tolerances
          • Exact registration/laser direct imaging
          • Front to back registration of etched cores to +/-.001"
          • Mixed Dielectric constructions
          • Buried / Blind / Microvia
          • Ormet interconnects
          • Multilevel cavity constructions
          • Optical mill / drill
          • Laser routing
          • Sequential lamination
          • Formed PCB'S
          • Plated edges

          Back Drill for Precision Stub Removal

          • Mechanical back-drilling (Minimal stub)
          • Laser drilling (No stub)
          • Laser modified controlled depth drill (Mechanical drill followed by laser cleanup, no stub)

          Hole Fill

          • Conductive, nonconductive, and partial hole fill options

          Thermal Solutions

          • Copper coins and slugs
          • Metal Core & Metal Back
          • Thermally conductive laminates
          • Heatsink assembly department to laminate heatsink or interface plates to the circuit boards

          Embedded Capabilities

          • Planar Resistors
            • Ohmega and Ticer
            • Screened Ink Resistors
          • Circulators
            • On board circuit
            • Embedded ferrites

          Surface Finishes

          • ENIG – electroless nickel, soft immersion gold – standard solder assemblies
          • ENEPIG - electroless nickel, electroless palladium, immersion gold
          • Hard and soft wirebondable gold
          • Immersion silver

          Assembly and Test

          • RF assembly of connector, surface mount component, drop-in cavity components, hand and automated solder assembly options
          • RF test center including 6 Network analyzers with combined frequency sweep coverage of 50MHz to 40GHz.
          • Custom anechoic boxes for antenna measurements
          • Switch matrix capability for multiple measurements between human interaction
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