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          Products and Services

          We offer a wide range of PCB products including conventional PCBs, HDI PCBs, flexible PCBs, rigid-flex PCBs, backplane assemblies, and IC substrates. We also offer value-added services to support our customers' needs.

          TTM services also include Electro-Mechanical Solutions (E-MS). Our products in this area include sheet metal design and fabrication, backplane assembly, system integration, test and logistics for a complete solution supporting sub-system and full system integration requirements.

          Printed Circuit Board Fabrication

          Conventional PCB

          • Multilayer up to 60+ layers
          • Embedded passives
          • Heavy copper up to 10 oz.
          • Over 50 UL approved laminates
          • Thickness up to 0.450"
          • Thin core dielectrics
          • Dimensions up to 30" x 54"
          • Mixed dielectrics

          HDI

          • Up to 12L "anylayer" stacked uVia Structure
          • 1.6 / 2.0 mil line / space
          • Wide material and surface finish selections
          • 14 mil, 6L ultra thin structure
          • 3/7 mil uVia / Pad size
          • 0.4 mm pitch BGA with 2 traces fanout
          • Embedded, distributed and discrete passive components

          Flex & Rigid-Flex

          • Type 2, 3 and 4 (double sided, multilayer and rigid-flex)
          • 30+ layers
          • Dimensions up to 24" x 48"
          • Acrylic, epoxy and adhesive-less polyimide flex materials
          • Over 50 rigid material options
          • Thickness up 0.300"
          • Bikini cut, bookbinder and loose leaf construction
          • Combination surface finishes
          • Epoxy fillet

          RF & Microwave

          • High frequency / bandwidth designs
          • Planar and screened resistors
          • Dimensions up to 24" x 48"
          • Mixed dielectrics (hybrids)
          • Dielectric foam
          • Conductive paste
          • Plated cavities
          • Formed (conformal) PCBs
          • Optical machining

          Thermal Management

          • Passive and active designs
          • Buried metal core constructions
          • Externally mounted heatsinks
          • Epoxy and B-stage films
          • Thermal & conductive bonding
          • Aluminum & copper base materials
          • Various surface finishes
          • In-house milling and bonding

          IC Substrate

          • 2,4,6 Layers (2+2+2 stacked via)
          • BT material
          • Wire bonding (ENEPIG, Soft gold, Hard gold)
          • Type: SIP,CSP,BOC & FC package
          • Fine trace width/space 25/25um
          • Thin board: 130um(2L), 170um(4L)
          • Flip chip C4 pad

          Custom Assembly

          Backplanes

          • Dimensions up to 28" x 52"
          • Thickness up to 0.400"
          • Custom and Industry Standard
          • Press-fit (compliant a€“pin)
          • Surface mount (chip, QFP, BGA)
          • Wave / selective solder
          • AOI & X-ray inspection
          • Level 2, 3 & 4 testing
          • Conformal coating

          Flex & Rigid-Flex

          • Dimensions up to 22" x 52"
          • Passive & active components
          • Press-fit (compliant-pin)
          • Surface mount (chip, QFP, BGA)
          • AOI & X-ray inspection
          • Level 2,3, & 4 testing

          RF & Microwave

          • Dimensions up to 22" x 34"
          • Blind via, surface mount, thru-hole
          • 1-piece hermetic GPO and GPPO
          • X-ray inspection
          • RF testing (20+ GHz)

          Integrated Assembly

          • Card cage through cabinet
          • Backplanes & Midplanes
          • Harnessing & cabling
          • Power supplies & fan trays
          • Peripherals & controllers
          • I/O interfaces
          • Functional testing
          • Mil & Aero conduction cooled
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